A-Team_Digital_Solutions/android_kernel_motorola_sm6375
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Merge branch 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux into thermal

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Conflicts:
	drivers/staging/omap-thermal/omap-thermal-common.
		OMAP supplied dummy TC1 and TC2,
		at the same time that the thermal tree removed them
		from thermal_zone_device_register()

	drivers/thermal/cpu_cooling.c b/drivers/thermal/cpu_cooling.c
		propogate the upstream MAX_IDR_LEVEL re-name
			to prevent a build failure

	Previously-fixed-by: Stephen Rothwell <[email protected]>

Signed-off-by: Len Brown <[email protected]>
This commit is contained in:
Len Brown 2012-10-09 01:35:52 -04:00
commit 29b19e2504
21 changed files with 2177 additions and 728 deletions
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2
drivers/power/power_supply_core.c
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@ -201,7 +201,7 @@ static int psy_register_thermal(struct power_supply *psy)
for (i = 0; i < psy->num_properties; i++) {
if (psy->properties[i] == POWER_SUPPLY_PROP_TEMP) {
psy->tzd = thermal_zone_device_register(psy->name, 0, 0,
psy, &psy_tzd_ops, 0, 0, 0, 0);
psy, &psy_tzd_ops, 0, 0);
if (IS_ERR(psy->tzd))
return PTR_ERR(psy->tzd);
break;