dt-bindings: thermal: Update CPU voltage cooling device bindings

Update bindings for the updated properties of CPU voltage cooling
device.

Change-Id: I5af1f1c203a7374f493cc98409cb3ac48feb5d55
This commit is contained in:
Priyansh Jain 2022-07-26 14:46:25 +05:30 • committed by Gerrit - the friendly Code Review server
commit 3b2b075db1

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@ -15,11 +15,24 @@ Required Parameters:
driver.
voltage cooling device node properties:
-qcom,cpus:
- apc1_cluster: thermal-cluster-a-b
Usage: required
Definition : CPU voltage cooling device node name. where 'a' is the
1st core of 1st cluster and 'b' is 1st core of 2nd cluster.
-qcom,cluster0:
Usage: required
Value type: An array of CPU phandle
Definition: Specify array of 2 CPU phandles, which needs to be
used for building a voltage based mitigation table.
Definition: Specify array of CPU phandles available in 1st cluster,
which needs to be used for building a voltage based mitigation
table.
-qcom,cluster1:
Usage: required
Value type: An array of CPU phandle
Definition: Specify array of CPU phandles available in 2nd cluster,
which needs to be used for building a voltage based mitigation
table.
-#cooling-cells:
Usage: required
@ -35,8 +48,9 @@ Optional Parameters:
Example:
qcom,cpu-voltage-cdev {
compatible = "qcom,cc-cooling-devices";
apc1_cluster: qcom,apc1-cluster {
qcom,cpus = <&CPU4 &CPU7>;
apc1_cluster: thermal-cluster-4-7 {
qcom,cluster0 = <&CPU4 &CPU5 &CPU6>;
qcom,cluster1 = <&CPU7>;
#cooling-cells = <2>;
};
};