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dt-bindings: thermal: Update CPU voltage cooling device bindings
Update bindings for the updated properties of CPU voltage cooling device. Change-Id: I5af1f1c203a7374f493cc98409cb3ac48feb5d55
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1 changed files with 19 additions and 5 deletions
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@ -15,11 +15,24 @@ Required Parameters:
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driver.
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voltage cooling device node properties:
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-qcom,cpus:
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- apc1_cluster: thermal-cluster-a-b
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Usage: required
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Definition : CPU voltage cooling device node name. where 'a' is the
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1st core of 1st cluster and 'b' is 1st core of 2nd cluster.
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-qcom,cluster0:
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Usage: required
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Value type: An array of CPU phandle
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Definition: Specify array of 2 CPU phandles, which needs to be
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used for building a voltage based mitigation table.
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Definition: Specify array of CPU phandles available in 1st cluster,
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which needs to be used for building a voltage based mitigation
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table.
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-qcom,cluster1:
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Usage: required
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Value type: An array of CPU phandle
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Definition: Specify array of CPU phandles available in 2nd cluster,
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which needs to be used for building a voltage based mitigation
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table.
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-#cooling-cells:
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Usage: required
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@ -35,8 +48,9 @@ Optional Parameters:
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Example:
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qcom,cpu-voltage-cdev {
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compatible = "qcom,cc-cooling-devices";
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apc1_cluster: qcom,apc1-cluster {
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qcom,cpus = <&CPU4 &CPU7>;
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apc1_cluster: thermal-cluster-4-7 {
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qcom,cluster0 = <&CPU4 &CPU5 &CPU6>;
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qcom,cluster1 = <&CPU7>;
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#cooling-cells = <2>;
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};
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};
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