From a60fa1e7a008c8772a5970ec8ff16106a01dc2ef Mon Sep 17 00:00:00 2001 From: Ram Chandrasekar Date: Wed, 8 Apr 2020 16:19:49 -0700 Subject: [PATCH] dt-bindings: thermal: Use the correct vendor string for voltage device Use the correct vendor string qcom instead of qti to adhere with the vendor prefix documentation. Change-Id: I72761a9a188a1b4ad550e2493cb2b1c213dbac3f --- bindings/thermal/qti-voltage-cooling.txt | 4 ++-- 1 file changed, 2 insertions(+), 2 deletions(-) diff --git a/bindings/thermal/qti-voltage-cooling.txt b/bindings/thermal/qti-voltage-cooling.txt index 28259ac148e8..ad5b3436aba0 100644 --- a/bindings/thermal/qti-voltage-cooling.txt +++ b/bindings/thermal/qti-voltage-cooling.txt @@ -11,7 +11,7 @@ cluster voltage. This is achieved by building a mitigation table mapping the CPU frequency levels to a voltage. Required Parameters: -- compatible: must be 'qti,cc-cooling-devices' for cpu voltage cooling device +- compatible: must be 'qcom,cc-cooling-devices' for cpu voltage cooling device driver. voltage cooling device node properties: @@ -34,7 +34,7 @@ Optional Parameters: Example: qcom,cpu-voltage-cdev { - compatible = "qti,cc-cooling-devices"; + compatible = "qcom,cc-cooling-devices"; apc1_cluster: qcom,apc1-cluster { qcom,cpus = <&CPU4 &CPU7>; #cooling-cells = <2>;