mirror of
https://github.com/BobTheBlinker/android_kernel_motorola_sm6375.git
synced 2026-10-14 08:36:12 -04:00
power: supply: core: fix HWMON temperature labels
commit 6b20464ad9fb5fd76ef6f219ce62156aa9639dcc upstream.
tempX_label files are swapped compared to what
power_supply_hwmon_temp_to_property() uses. Make them match.
Cc: stable@vger.kernel.org
Fixes: e67d4dfc9f ("power: supply: Add HWMON compatibility layer")
Signed-off-by: Michał Mirosław <mirq-linux@rere.qmqm.pl>
Signed-off-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
This commit is contained in:
parent
0fd525d817
commit
6050811edf
1 changed files with 1 additions and 1 deletions
|
|
@ -144,7 +144,7 @@ static int power_supply_hwmon_read_string(struct device *dev,
|
|||
u32 attr, int channel,
|
||||
const char **str)
|
||||
{
|
||||
*str = channel ? "temp" : "temp ambient";
|
||||
*str = channel ? "temp ambient" : "temp";
|
||||
return 0;
|
||||
}
|
||||
|
||||
|
|
|
|||
Loading…
Reference in a new issue