From 84a4f0a0e2f4c8f897629bedbce41eb8f6efb6c5 Mon Sep 17 00:00:00 2001
From: Ram Chandrasekar <rkumbako@quicinc.com>
Date: Tue, 31 Mar 2020 14:06:46 -0700
Subject: [PATCH] ARM: dts: msm: Enable CPU voltage cooling device for lahaina

Enable CPU voltage cooling device for APC1 cluster including cpu 4 and 7
for lahaina. This will enable thermal framework to achieve voltage
reduction in APC1 rail by bringing down both gold and gold+ frequency
based on voltage.

Change-Id: I61b8767bb4c3999358d05e37903caaf144f46005
---
 qcom/lahaina-thermal.dtsi | 8 ++++++++
 1 file changed, 8 insertions(+)

diff --git a/qcom/lahaina-thermal.dtsi b/qcom/lahaina-thermal.dtsi
index 44007fbc7d8e..313216d406ec 100644
--- a/qcom/lahaina-thermal.dtsi
+++ b/qcom/lahaina-thermal.dtsi
@@ -52,6 +52,14 @@
 		isens_vref_1p8-supply = <&pm8350c_l1_ao>;
 		isens-vref-1p8-settings = <1800000 1800000 20000>;
 	};
+
+	qcom,cpu-voltage-cdev {
+		compatible = "qcom,cc-cooling-devices";
+		apc1_cluster: qcom,apc1-cluster {
+			qcom,cpus = <&CPU4 &CPU7>;
+			#cooling-cells = <2>;
+		};
+	};
 };
 
 &msm_gpu {