mirror of
https://github.com/BobTheBlinker/android_kernel_motorola_sm6375.git
synced 2026-10-30 03:27:44 -04:00
Documentation: thermal: document of_cpufreq_cooling_register()
Commit 39d99cff76 ("thermal: cpu_cooling: introduce
of_cpufreq_cooling_register") taught the cpu cooling device to register
devices that were linked to the device tree but didn't update the
cpu-cooling-api documentation. Fix it.
Cc: Amit Daniel Kachhap <[email protected]>
Cc: Jonathan Corbet <[email protected]>
Cc: Zhang Rui <[email protected]>
Cc: Eduardo Valentin <[email protected]>
Signed-off-by: Javi Merino <[email protected]>
Signed-off-by: Eduardo Valentin <[email protected]>
This commit is contained in:
parent
d26eef8b72
commit
9477e18dd5
1 changed files with 13 additions and 2 deletions
|
|
@ -3,7 +3,7 @@ CPU cooling APIs How To
|
|||
|
||||
Written by Amit Daniel Kachhap <[email protected]>
|
||||
|
||||
Updated: 12 May 2012
|
||||
Updated: 6 Jan 2015
|
||||
|
||||
Copyright (c) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com)
|
||||
|
||||
|
|
@ -25,7 +25,18 @@ the user. The registration APIs returns the cooling device pointer.
|
|||
|
||||
clip_cpus: cpumask of cpus where the frequency constraints will happen.
|
||||
|
||||
1.1.2 void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)
|
||||
1.1.2 struct thermal_cooling_device *of_cpufreq_cooling_register(
|
||||
struct device_node *np, const struct cpumask *clip_cpus)
|
||||
|
||||
This interface function registers the cpufreq cooling device with
|
||||
the name "thermal-cpufreq-%x" linking it with a device tree node, in
|
||||
order to bind it via the thermal DT code. This api can support multiple
|
||||
instances of cpufreq cooling devices.
|
||||
|
||||
np: pointer to the cooling device device tree node
|
||||
clip_cpus: cpumask of cpus where the frequency constraints will happen.
|
||||
|
||||
1.1.3 void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)
|
||||
|
||||
This interface function unregisters the "thermal-cpufreq-%x" cooling device.
|
||||
|
||||
|
|
|
|||
Loading…
Reference in a new issue