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Merge "dt-bindings: Add snapshot of RPM SMD devicetree binding"
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bindings/thermal/qcom,rpm-smd-cdev.txt
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bindings/thermal/qcom,rpm-smd-cdev.txt
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Qualcomm Technologies, Inc. RPM SMD cooling device
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The RPM shared memory(SMD) cooling device, will be used to set
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different thermal band level to RPM hardware. When threshold violation
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occurs, RPM SMD cooling device sends pre-configured thermal band level
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to RPM hardware via SMD.
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Required Parameters:
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- compatible:
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Usage: required
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Value type: <string>
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Definition: should be "qcom,rpm-smd-cooling-device"
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- #cooling-cells:
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Usage: required
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Value type: <integer>
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Definition: Must be 2. This is required by of-thermal and refer the doc
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<devicetree/bindings/thermal/thermal.txt> for more details.
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Example:
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&rpm_bus {
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rpm_smd_cdev: rpm-smd-cdev {
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compatible = "qcom,rpm-smd-cooling-device";
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#cooling-cells = <2>;
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};
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};
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