Merge branch 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/lenb/linux

Pull ACPI & Thermal updates from Len Brown:
 "The generic Linux thermal layer is gaining some new capabilities
  (generic cooling via cpufreq) and some new customers (ARM).

  Also, an ACPI EC bug fix plus a regression fix."

* 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/lenb/linux: (30 commits)
  tools/power/acpi/acpidump: remove duplicated include from acpidump.c
  ACPI idle, CPU hotplug: Fix NULL pointer dereference during hotplug
  cpuidle / ACPI: fix potential NULL pointer dereference
  ACPI: EC: Add a quirk for CLEVO M720T/M730T laptop
  ACPI: EC: Make the GPE storm threshold a module parameter
  thermal: Exynos: Fix NULL pointer dereference in exynos_unregister_thermal()
  Thermal: Fix bug on cpu_cooling, cooling device's id conflict problem.
  thermal: exynos: Use devm_* functions
  ARM: exynos: add thermal sensor driver platform data support
  thermal: exynos: register the tmu sensor with the kernel thermal layer
  thermal: exynos5: add exynos5250 thermal sensor driver support
  hwmon: exynos4: move thermal sensor driver to driver/thermal directory
  thermal: add generic cpufreq cooling implementation
  Fix a build error.
  thermal: Fix potential NULL pointer accesses
  thermal: add Renesas R-Car thermal sensor support
  thermal: fix potential out-of-bounds memory access
  Thermal: Introduce locking for cdev.thermal_instances list.
  Thermal: Unify the code for both active and passive cooling
  Thermal: Introduce simple arbitrator for setting device cooling state
  ...

Documentation/thermal/cpu-cooling-api.txt

@@ -0,0 +1,32 @@
+CPU cooling APIs How To
+===================================
+
+Written by Amit Daniel Kachhap <[email protected]>
+
+Updated: 12 May 2012
+
+Copyright (c)  2012 Samsung Electronics Co., Ltd(http://www.samsung.com)
+
+0. Introduction
+
+The generic cpu cooling(freq clipping) provides registration/unregistration APIs
+to the caller. The binding of the cooling devices to the trip point is left for
+the user. The registration APIs returns the cooling device pointer.
+
+1. cpu cooling APIs
+
+1.1 cpufreq registration/unregistration APIs
+1.1.1 struct thermal_cooling_device *cpufreq_cooling_register(
+	struct cpumask *clip_cpus)
+
+    This interface function registers the cpufreq cooling device with the name
+    "thermal-cpufreq-%x". This api can support multiple instances of cpufreq
+    cooling devices.
+
+   clip_cpus: cpumask of cpus where the frequency constraints will happen.
+
+1.1.2 void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)
+
+    This interface function unregisters the "thermal-cpufreq-%x" cooling device.
+
+    cdev: Cooling device pointer which has to be unregistered.

Documentation/thermal/exynos_thermal

@@ -46,36 +46,7 @@ The threshold levels are defined as follows:
   The threshold and each trigger_level are set
   through the corresponding registers.
 
-When an interrupt occurs, this driver notify user space of
-one of four threshold levels for the interrupt
-through kobject_uevent_env and sysfs_notify functions.
+When an interrupt occurs, this driver notify kernel thermal framework
+with the function exynos4_report_trigger.
 Although an interrupt condition for level_0 can be set,
-it is not notified to user space through sysfs_notify function.
-
-Sysfs Interface
----------------
-name		name of the temperature sensor
-		RO
-
-temp1_input	temperature
-		RO
-
-temp1_max	temperature for level_1 interrupt
-		RO
-
-temp1_crit	temperature for level_2 interrupt
-		RO
-
-temp1_emergency	temperature for level_3 interrupt
-		RO
-
-temp1_max_alarm	alarm for level_1 interrupt
-		RO
-
-temp1_crit_alarm
-		alarm for level_2 interrupt
-		RO
-
-temp1_emergency_alarm
-		alarm for level_3 interrupt
-		RO
+it can be used to synchronize the cooling action.

Documentation/thermal/sysfs-api.txt

@@ -84,7 +84,8 @@ temperature) and throttle appropriate devices.
 
 1.3 interface for binding a thermal zone device with a thermal cooling device
 1.3.1 int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz,
-		int trip, struct thermal_cooling_device *cdev);
+	int trip, struct thermal_cooling_device *cdev,
+	unsigned long upper, unsigned long lower);
 
     This interface function bind a thermal cooling device to the certain trip
     point of a thermal zone device.
@@ -93,6 +94,12 @@ temperature) and throttle appropriate devices.
     cdev: thermal cooling device
     trip: indicates which trip point the cooling devices is associated with
 	  in this thermal zone.
+    upper:the Maximum cooling state for this trip point.
+          THERMAL_NO_LIMIT means no upper limit,
+	  and the cooling device can be in max_state.
+    lower:the Minimum cooling state can be used for this trip point.
+          THERMAL_NO_LIMIT means no lower limit,
+	  and the cooling device can be in cooling state 0.
 
 1.3.2 int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz,
 		int trip, struct thermal_cooling_device *cdev);