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https://github.com/BobTheBlinker/android_kernel_motorola_sm6375.git
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Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal management updates from Zhang Rui: - Introduce generic ADC thermal driver, based on OF thermal (Laxman Dewangan) - Introduce new thermal driver for Tango chips (Marc Gonzalez) - Rockchip driver support for RK3399, RK3366, and some fixes (Caesar Wang, Elaine Zhang and Shawn Lin) - Add CPU power cooling model to Mediatek thermal driver (Dawei Chien) - Wider usage of dev_thermal_zone_of_sensor_register (Eduardo Valentin) - TI thermal driver gained a new maintainer (Keerthy). - Enabled powerclamp driver by checking CPU feature and package cstate counter instead of CPU whitelist (Jacob Pan) - Various fixes on thermal governor, OF thermal, Tegra, and RCAR * 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (50 commits) thermal: tango: initialize TEMPSI_CFG thermal: rockchip: use the usleep_range instead of udelay thermal: rockchip: add the notes for better reading thermal: rockchip: Support RK3366 SoCs in the thermal driver thermal: rockchip: handle the power sequence for tsadc controller thermal: rockchip: update the tsadc table for rk3399 thermal: rockchip: fixes the code_to_temp for tsadc driver thermal: rockchip: disable thermal->clk in err case thermal: tegra: add Tegra132 specific SOC_THERM driver thermal: fix ptr_ret.cocci warnings thermal: mediatek: Add cpu dynamic power cooling model. thermal: generic-adc: Add ADC based thermal sensor driver thermal: generic-adc: Add DT binding for ADC based thermal sensor thermal: tegra: fix static checker warning thermal: tegra: mark PM functions __maybe_unused thermal: add temperature sensor support for tango SoC thermal: hisilicon: fix IRQ imbalance enabling thermal: hisilicon: support to use any sensor thermal: rcar: Remove binding docs for r8a7794 thermal: tegra: add PM support ...
This commit is contained in:
Linus Torvalds
commit
bfb764440d
38 changed files with 2414 additions and 763 deletions
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@ -26,6 +26,10 @@ Required properties :
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of this property. See <dt-bindings/thermal/tegra124-soctherm.h> for a
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list of valid values when referring to thermal sensors.
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Note:
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- the "critical" type trip points will be set to SOC_THERM hardware as the
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shut down temperature. Once the temperature of this thermal zone is higher
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than it, the system will be shutdown or reset by hardware.
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Example :
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@ -51,5 +55,13 @@ Example: referring to thermal sensors :
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thermal-sensors =
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<&soctherm TEGRA124_SOCTHERM_SENSOR_CPU>;
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trips {
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cpu_shutdown_trip: shutdown-trip {
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temperature = <102500>;
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hysteresis = <1000>;
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type = "critical";
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};
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};
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};
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};
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@ -11,7 +11,6 @@ Required properties:
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- "renesas,thermal-r8a7791" (R-Car M2-W)
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- "renesas,thermal-r8a7792" (R-Car V2H)
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- "renesas,thermal-r8a7793" (R-Car M2-N)
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- "renesas,thermal-r8a7794" (R-Car E2)
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- reg : Address range of the thermal registers.
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The 1st reg will be recognized as common register
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if it has "interrupts".
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17
Documentation/devicetree/bindings/thermal/tango-thermal.txt
Normal file
17
Documentation/devicetree/bindings/thermal/tango-thermal.txt
Normal file
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@ -0,0 +1,17 @@
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* Tango Thermal
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The SMP8758 SoC includes 3 instances of this temperature sensor
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(in the CPU, video decoder, and PCIe controller).
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Required properties:
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- #thermal-sensor-cells: Should be 0 (see thermal.txt)
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- compatible: "sigma,smp8758-thermal"
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- reg: Address range of the thermal registers
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Example:
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cpu_temp: thermal@920100 {
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#thermal-sensor-cells = <0>;
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compatible = "sigma,smp8758-thermal";
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reg = <0x920100 12>;
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};
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@ -0,0 +1,89 @@
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General Purpose Analog To Digital Converter (ADC) based thermal sensor.
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On some of platforms, thermal sensor like thermistors are connected to
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one of ADC channel and sensor resistance is read via voltage across the
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sensor resistor. The voltage read across the sensor is mapped to
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temperature using voltage-temperature lookup table.
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Required properties:
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===================
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- compatible: Must be "generic-adc-thermal".
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- temperature-lookup-table: Two dimensional array of Integer; lookup table
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to map the relation between ADC value and
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temperature. When ADC is read, the value is
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looked up on the table to get the equivalent
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temperature.
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The first value of the each row of array is the
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temperature in milliCelsius and second value of
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the each row of array is the ADC read value.
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- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description
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of this property.
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Example :
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#include <dt-bindings/thermal/thermal.h>
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i2c@7000c400 {
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ads1015: ads1015@4a {
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reg = <0x4a>;
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compatible = "ads1015";
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sampling-frequency = <3300>;
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#io-channel-cells = <1>;
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};
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};
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tboard_thermistor: thermal-sensor {
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compatible = "generic-adc-thermal";
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#thermal-sensor-cells = <0>;
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io-channels = <&ads1015 1>;
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io-channel-names = "sensor-channel";
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temperature-lookup-table = < (-40000) 2578
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(-39000) 2577
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(-38000) 2576
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(-37000) 2575
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(-36000) 2574
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(-35000) 2573
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(-34000) 2572
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(-33000) 2571
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(-32000) 2569
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(-31000) 2568
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(-30000) 2567
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::::::::::
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118000 254
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119000 247
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120000 240
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121000 233
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122000 226
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123000 220
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124000 214
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125000 208>;
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};
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dummy_cool_dev: dummy-cool-dev {
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compatible = "dummy-cooling-dev";
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#cooling-cells = <2>; /* min followed by max */
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};
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thermal-zones {
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Tboard {
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polling-delay = <15000>; /* milliseconds */
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polling-delay-passive = <0>; /* milliseconds */
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thermal-sensors = <&tboard_thermistor>;
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trips {
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therm_est_trip: therm_est_trip {
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temperature = <40000>;
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type = "active";
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hysteresis = <1000>;
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};
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};
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cooling-maps {
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map0 {
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trip = <&therm_est_trip>;
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cooling-device = <&dummy_cool_dev THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
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contribution = <100>;
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};
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};
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};
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};
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@ -69,8 +69,8 @@ temperature) and throttle appropriate devices.
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1.1.2 void thermal_zone_device_unregister(struct thermal_zone_device *tz)
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This interface function removes the thermal zone device.
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It deletes the corresponding entry form /sys/class/thermal folder and
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unbind all the thermal cooling devices it uses.
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It deletes the corresponding entry from /sys/class/thermal folder and
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unbinds all the thermal cooling devices it uses.
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1.1.3 struct thermal_zone_device *thermal_zone_of_sensor_register(
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struct device *dev, int sensor_id, void *data,
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@ -146,32 +146,32 @@ temperature) and throttle appropriate devices.
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This interface function adds a new thermal cooling device (fan/processor/...)
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to /sys/class/thermal/ folder as cooling_device[0-*]. It tries to bind itself
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to all the thermal zone devices register at the same time.
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to all the thermal zone devices registered at the same time.
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name: the cooling device name.
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devdata: device private data.
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ops: thermal cooling devices call-backs.
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.get_max_state: get the Maximum throttle state of the cooling device.
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.get_cur_state: get the Current throttle state of the cooling device.
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.get_cur_state: get the Currently requested throttle state of the cooling device.
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.set_cur_state: set the Current throttle state of the cooling device.
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1.2.2 void thermal_cooling_device_unregister(struct thermal_cooling_device *cdev)
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This interface function remove the thermal cooling device.
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It deletes the corresponding entry form /sys/class/thermal folder and
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unbind itself from all the thermal zone devices using it.
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This interface function removes the thermal cooling device.
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It deletes the corresponding entry from /sys/class/thermal folder and
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unbinds itself from all the thermal zone devices using it.
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1.3 interface for binding a thermal zone device with a thermal cooling device
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1.3.1 int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz,
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int trip, struct thermal_cooling_device *cdev,
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unsigned long upper, unsigned long lower, unsigned int weight);
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This interface function bind a thermal cooling device to the certain trip
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This interface function binds a thermal cooling device to a particular trip
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point of a thermal zone device.
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This function is usually called in the thermal zone device .bind callback.
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tz: the thermal zone device
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cdev: thermal cooling device
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trip: indicates which trip point the cooling devices is associated with
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in this thermal zone.
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trip: indicates which trip point in this thermal zone the cooling device
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is associated with.
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upper:the Maximum cooling state for this trip point.
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THERMAL_NO_LIMIT means no upper limit,
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and the cooling device can be in max_state.
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@ -184,13 +184,13 @@ temperature) and throttle appropriate devices.
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1.3.2 int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz,
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int trip, struct thermal_cooling_device *cdev);
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This interface function unbind a thermal cooling device from the certain
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This interface function unbinds a thermal cooling device from a particular
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trip point of a thermal zone device. This function is usually called in
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the thermal zone device .unbind callback.
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tz: the thermal zone device
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cdev: thermal cooling device
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trip: indicates which trip point the cooling devices is associated with
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in this thermal zone.
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trip: indicates which trip point in this thermal zone the cooling device
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is associated with.
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1.4 Thermal Zone Parameters
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1.4.1 struct thermal_bind_params
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@ -210,13 +210,13 @@ temperature) and throttle appropriate devices.
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this thermal zone and cdev, for a particular trip point.
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If nth bit is set, then the cdev and thermal zone are bound
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for trip point n.
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.limits: This is an array of cooling state limits. Must have exactly
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2 * thermal_zone.number_of_trip_points. It is an array consisting
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of tuples <lower-state upper-state> of state limits. Each trip
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will be associated with one state limit tuple when binding.
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A NULL pointer means <THERMAL_NO_LIMITS THERMAL_NO_LIMITS>
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on all trips. These limits are used when binding a cdev to a
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trip point.
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.binding_limits: This is an array of cooling state limits. Must have
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exactly 2 * thermal_zone.number_of_trip_points. It is an
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array consisting of tuples <lower-state upper-state> of
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state limits. Each trip will be associated with one state
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limit tuple when binding. A NULL pointer means
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<THERMAL_NO_LIMITS THERMAL_NO_LIMITS> on all trips.
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These limits are used when binding a cdev to a trip point.
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.match: This call back returns success(0) if the 'tz and cdev' need to
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be bound, as per platform data.
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1.4.2 struct thermal_zone_params
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@ -351,8 +351,8 @@ cdev[0-*]
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RO, Optional
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cdev[0-*]_trip_point
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The trip point with which cdev[0-*] is associated in this thermal
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zone; -1 means the cooling device is not associated with any trip
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The trip point in this thermal zone which cdev[0-*] is associated
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with; -1 means the cooling device is not associated with any trip
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point.
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RO, Optional
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