From dd0c146ee3a8472289cee0961595ee79aec900e0 Mon Sep 17 00:00:00 2001
From: Manaf Meethalavalappu Pallikunhi <manafm@qti.qualcomm.com>
Date: Tue, 17 Dec 2019 13:19:31 +0530
Subject: [PATCH] dt-bindings: thermal: Add support for CDSP cooling devices
 via qmi cdev

Add support for CDSP DCVS and CDSP hardware cooling devices to QMI
cooling device driver. These cooling devices can be used to mitigate
CDSP subsystem at high temperature via qmi interface.

Change-Id: I064d5685e1c2c9c7d0406ee3bdd7f48169602a92
---
 bindings/thermal/qti-qmi-cdev.txt | 12 ++++++++++++
 1 file changed, 12 insertions(+)

diff --git a/bindings/thermal/qti-qmi-cdev.txt b/bindings/thermal/qti-qmi-cdev.txt
index 481c284543be..aeff953af9a9 100644
--- a/bindings/thermal/qti-qmi-cdev.txt
+++ b/bindings/thermal/qti-qmi-cdev.txt
@@ -53,6 +53,8 @@ Subsystem properties:
 			"mmw_skin3" -> MMW skin mitigation device3,
 			"cpr_cold" -> for cpr restriction.
 			"wlan" -> for modem wlan mitigation device.
+			"cdsp_sw" -> for CDSP DCVS mitigation device.
+			"cdsp_hw" -> for CDSP hardware mitigation device.
 
 	-#cooling-cells:
 		Usage: required
@@ -111,6 +113,16 @@ Example:
 				qcom,qmi-dev-name = "cpuv_restriction_cold";
 				#cooling-cells = <2>;
 			};
+
+			cdsp_sw: cdsp {
+				qcom,qmi-dev-name = "cdsp_sw";
+				#cooling-cells = <2>;
+			};
+
+			cdsp_hw: hvx {
+				qcom,qmi-dev-name = "cdsp_hw";
+				#cooling-cells = <2>;
+			};
 		};
 
 		slpi {