A-Team_Digital_Solutions/android_kernel_motorola_sm6375
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950 commits 10 branches 0 tags 2.1 GiB
  • C 98.2%
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Repository files (latest commit first)
Filename Latest commit message Latest commit date
Ram Chandrasekar 1c33eb3004 dt-bindings: thermal: Add documentation for CPU voltage cooling device 
Add documentation for CPU voltage cooling device. CPU voltage cooling
device will provide support to apply CPU frequency mitigation on the
different CPUs in a cluster to achieve a reduction in cluster voltage.
This is achieved by building a mitigation table mapping the CPU
frequency levels to a voltage.

Change-Id: I41a222c54442bdc065267f1f1cf079118b8032e9
2020-04-02 09:17:16 -07:00
bindings dt-bindings: thermal: Add documentation for CPU voltage cooling device 2020-04-02 09:17:16 -07:00
qcom Merge "ARM: dts: msm: remove CX, MX and MMCX always-on configuration for Lahaina" 2020-03-31 11:49:53 -07:00
Makefile ARM: dts: vendor: Add an initial Makefile to the vendor 2019-06-04 16:50:48 -07:00