A-Team_Digital_Solutions/android_kernel_motorola_sm6375
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Repository files (latest commit first)
Filename Latest commit message Latest commit date
Ram Chandrasekar 4d129a3916 dt-bindings: thermal: Add support for modem DSC cooling devices 
Modem supports new DSC based mitigation nodes, which are not timer
based. Add support for these new TMD devices to be registered as cooling
devices in thermal framework.

Change-Id: I1a7e5f2b9ec533e8ca8e380266c05dfcec3db8e2
2020-04-20 12:18:40 -07:00
bindings dt-bindings: thermal: Add support for modem DSC cooling devices 2020-04-20 12:18:40 -07:00
qcom ARM: dts: msm: Add modem DSC mitigation nodes for lahaina 2020-04-16 13:04:34 -07:00
Makefile ARM: dts: vendor: Add an initial Makefile to the vendor 2019-06-04 16:50:48 -07:00