android_kernel_motorola_sm6375/qcom/holi-thermal-overlay-pm6125.dtsi
Gopala Krishna Nuthaki dd31c83ad7 ARM: dts: msm: Enable cxipeak support for BLAIR
Enable cxipeak cooling device node for BLAIR and
holi-pm6125 variant.

Change-Id: I2f9f7d146724b2f937c5cb83d798385787f81de1
2021-06-28 00:29:35 -07:00

60 lines
990 B
Devicetree

#include <dt-bindings/thermal/thermal_qti.h>
&mdss_mdp {
#cooling-cells = <2>;
};
&cxip_cdev {
status = "ok"
};
&thermal_zones {
pm6125_tz {
cooling-maps {
trip0_cpu6 {
trip = <&pm6125_trip0>;
cooling-device =
<&CPU6 THERMAL_MAX_LIMIT
THERMAL_MAX_LIMIT>;
};
trip1_cpu4 {
trip = <&pm6125_trip0>;
cooling-device = <&cpu4_isolate 1 1>;
};
trip1_cpu5 {
trip = <&pm6125_trip0>;
cooling-device = <&cpu5_isolate 1 1>;
};
trip1_cpu6 {
trip = <&pm6125_trip0>;
cooling-device = <&cpu6_isolate 1 1>;
};
trip1_cpu7 {
trip = <&pm6125_trip0>;
cooling-device = <&cpu7_isolate 1 1>;
};
};
};
pmr735a_tz {
cooling-maps {
trip0_modem_tj {
trip = <&pmr735a_trip0>;
cooling-device =
<&modem_tj THERMAL_MAX_LIMIT
THERMAL_MAX_LIMIT>;
};
trip0_modem_pa {
trip = <&pmr735a_trip0>;
cooling-device =
<&modem_pa THERMAL_MAX_LIMIT
THERMAL_MAX_LIMIT>;
};
};
};
};