A-Team_Digital_Solutions/android_kernel_motorola_sm6375
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Filename Latest commit message Latest commit date
David Dai 822b7caf06 ARM: dts: msm: add stub interconnect devices for Lahaina 
Add stub interconnect devices for aggre1_noc, aggre2_noc,
config_noc, dc_noc, gem_noc, lpass_ag_noc, mc_virt_noc,
mmss_noc, nsp_noc, system_noc, This will allow consumers to
get their path and set bandwidth constraints on them.

Change-Id: Ic2ec48af802b6d763c857482facddf4367570b24
2019-07-15 16:56:46 -07:00
bindings Merge "ARM: dts: msm: Add SCM node for Lahaina SoC" 2019-07-09 18:00:15 -07:00
qcom ARM: dts: msm: add stub interconnect devices for Lahaina 2019-07-15 16:56:46 -07:00
Makefile ARM: dts: vendor: Add an initial Makefile to the vendor 2019-06-04 16:50:48 -07:00