android_kernel_motorola_sm6375/drivers/thermal
Repository files (latest commit first)
Filename Latest commit message Latest commit date
Yongqin Liu 3cf2181e43 thermal/drivers/hisi: Drop second sensor hi3660
[ Upstream commit 15cc25829a97c3957e520e971868aacc84341317 ]

The commit 74c8e6bffbe1 ("driver core: Add __alloc_size hint to devm
allocators") exposes a panic "BRK handler: Fatal exception" on the
hi3660_thermal_probe funciton.
This is because the function allocates memory for only one
sensors array entry, but tries to fill up a second one.

Fix this by removing the unneeded second access.

Fixes: 7d3a2a2bba ("thermal/drivers/hisi: Fix number of sensors on hi3660")
Signed-off-by: Yongqin Liu <yongqin.liu@linaro.org>
Link: https://lore.kernel.org/linux-mm/20221101223321.1326815-5-keescook@chromium.org/
Link: https://lore.kernel.org/r/20230210141507.71014-1-yongqin.liu@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Signed-off-by: Sasha Levin <sashal@kernel.org>
2023-03-11 16:43:43 +01:00
..
broadcom
intel thermal: intel: int340x: Add locking to int340x_thermal_get_trip_type() 2023-02-06 07:52:46 +01:00
qcom
samsung
st
tegra
ti-soc-thermal
armada_thermal.c
clock_cooling.c
cpu_cooling.c
da9062-thermal.c
db8500_thermal.c
devfreq_cooling.c
dove_thermal.c
fair_share.c
gov_bang_bang.c
hisi_thermal.c thermal/drivers/hisi: Drop second sensor hi3660 2023-03-11 16:43:43 +01:00
imx_thermal.c
Kconfig
kirkwood_thermal.c
Makefile
max77620_thermal.c
mtk_thermal.c
of-thermal.c
power_allocator.c
qoriq_thermal.c
rcar_gen3_thermal.c
rcar_thermal.c
rockchip_thermal.c
spear_thermal.c
step_wise.c
tango_thermal.c
thermal-generic-adc.c
thermal_core.c
thermal_core.h
thermal_helpers.c
thermal_hwmon.c
thermal_hwmon.h
thermal_mmio.c
thermal_sysfs.c thermal: sysfs: Fix cooling_device_stats_setup() error code path 2022-08-25 11:17:22 +02:00
uniphier_thermal.c
user_space.c
zx2967_thermal.c