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Filename Latest commit message Latest commit date
Ram Chandrasekar 84a4f0a0e2 ARM: dts: msm: Enable CPU voltage cooling device for lahaina
Enable CPU voltage cooling device for APC1 cluster including cpu 4 and 7
for lahaina. This will enable thermal framework to achieve voltage
reduction in APC1 rail by bringing down both gold and gold+ frequency
based on voltage.

Change-Id: I61b8767bb4c3999358d05e37903caaf144f46005
2020-04-08 16:24:12 -07:00
bindings dt-bindings: thermal: Use the correct vendor string for voltage device 2020-04-08 16:19:49 -07:00
qcom ARM: dts: msm: Enable CPU voltage cooling device for lahaina 2020-04-08 16:24:12 -07:00
Makefile ARM: dts: vendor: Add an initial Makefile to the vendor 2019-06-04 16:50:48 -07:00