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| Filename | Latest commit message | Latest commit date |
|---|---|---|
This patch adds syscon property for specifying soc-glue core into DT binding documentation. Currently, soc-glue core is used for changing the state of S/PDIF signal output pin to signal output state or Hi-Z state. If you don't need to use features on soc-glue described above you can ommit this property. Signed-off-by: Katsuhiro Suzuki <[email protected]> Signed-off-by: Mark Brown <[email protected]> |
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| .. | ||
| bindings | ||
| 00-INDEX | ||
| booting-without-of.txt | ||
| changesets.txt | ||
| dynamic-resolution-notes.txt | ||
| of_unittest.txt | ||
| overlay-notes.txt | ||
| todo.txt | ||
| usage-model.txt | ||