android_kernel_motorola_sm6375/drivers/thermal
Repository files (latest commit first)
Filename Latest commit message Latest commit date
Florian Fainelli 860a70e2a6 thermal: brcmstb_thermal: Do not use DT coefficients
commit e1ff6fc22f19e2af8adbad618526b80067911d40 upstream.

At the time the brcmstb_thermal driver and its binding were merged, the
DT binding did not make the coefficients properties a mandatory one,
therefore all users of the brcmstb_thermal driver out there have a non
functional implementation with zero coefficients. Even if these
properties were provided, the formula used for computation is incorrect.

The coefficients are entirely process specific (right now, only 28nm is
supported) and not board or SoC specific, it is therefore appropriate to
hard code them in the driver given the compatibility string we are
probed with which has to be updated whenever a new process is
introduced.

We remove the existing coefficients definition since subsequent patches
are going to add support for a new process and will introduce new
coefficients as well.

Fixes: 9e03cf1b2d ("thermal: add brcmstb AVS TMON driver")
Signed-off-by: Florian Fainelli <f.fainelli@gmail.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200114190607.29339-2-f.fainelli@gmail.com
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2020-03-05 16:43:50 +01:00
..
broadcom thermal: brcmstb_thermal: Do not use DT coefficients 2020-03-05 16:43:50 +01:00
intel Merge branch 'for-5.4' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux 2019-09-27 11:35:13 -07:00
qcom drivers: thermal: qcom: tsens: Fix memory leak from qfprom read 2019-08-28 21:05:08 +08:00
samsung
st
tegra thermal: tegra: Fix a typo 2019-08-28 17:56:45 +08:00
ti-soc-thermal
armada_thermal.c thermal: armada: Fix -Wshift-negative-value 2019-08-28 16:41:02 +08:00
clock_cooling.c
cpu_cooling.c cpufreq: Use per-policy frequency QoS 2019-10-21 02:05:21 +02:00
da9062-thermal.c
db8500_thermal.c thermal: db8500: Depromote debug print 2020-03-05 16:43:50 +01:00
devfreq_cooling.c
dove_thermal.c
fair_share.c
gov_bang_bang.c
hisi_thermal.c
imx_thermal.c
Kconfig thermal: db8500: Finalize device tree conversion 2019-09-24 22:54:49 -07:00
kirkwood_thermal.c
Makefile
max77620_thermal.c
mtk_thermal.c
of-thermal.c
power_allocator.c
qoriq_thermal.c thermal: qoriq: Use __maybe_unused instead of #if CONFIG_PM_SLEEP 2019-08-28 16:33:27 +08:00
rcar_gen3_thermal.c thermal: rcar_gen3_thermal: Replace devm_add_action() followed by failure action with devm_add_action_or_reset() 2019-08-28 17:51:26 +08:00
rcar_thermal.c
rockchip_thermal.c
spear_thermal.c
step_wise.c
tango_thermal.c
thermal-generic-adc.c
thermal_core.c thermal: Fix deadlock in thermal thermal_zone_device_check 2019-12-13 08:43:21 +01:00
thermal_core.h
thermal_helpers.c
thermal_hwmon.c thermal_hwmon: Sanitize thermal_zone type 2019-09-24 09:56:08 +08:00
thermal_hwmon.h
thermal_mmio.c thermal: thermal_mmio: remove some dead code 2019-09-22 13:44:52 -07:00
thermal_sysfs.c
uniphier_thermal.c
user_space.c
zx2967_thermal.c