A-Team_Digital_Solutions/android_kernel_motorola_sm6375
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229 commits 10 branches 0 tags 2.1 GiB
  • C 98.2%
  • Assembly 1%
  • Makefile 0.3%
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Repository files (latest commit first)
Filename Latest commit message Latest commit date
xuwt2 b47aa43bd7 power/driver: support thermal mitigation during charging 
-1,create mmi-pl-chg power supply instance
-2,add thermal mitigation interface

Change-Id: I884dd4fe7094b8c401f1c978d042763bffd7b230
Signed-off-by: xuwt2 <xuwt2@lenovo.com>
Reviewed-on: https://gerrit.mot.com/1210446
SLTApproved: Slta Waiver
SME-Granted: SME Approvals Granted
Tested-by: Jira Key
Reviewed-by: Yonghua Yan <yanyh2@motorola.com>
Reviewed-by: Jianqi Yang <yangj@motorola.com>
Submit-Approved: Jira Key
2018-07-25 07:34:20 -05:00
Documentation/devicetree/bindings extcon: madera: Add support for 2 gpio mic bias switch. 2018-07-12 17:27:48 -05:00
drivers power/driver: support thermal mitigation during charging 2018-07-25 07:34:20 -05:00
fs/exfat fs/exfat: reduce log spam 2017-12-12 12:35:59 -06:00
include extcon-madera: Handle USBC Audio Connections 2018-07-16 15:01:19 -05:00
sound/soc/codecs ASoC: wm_adsp: Limit I2C transfer buffer size 2018-07-24 15:02:08 -05:00
AndroidKernelModule.mk motorola: dlkm: Initial AndroidKernelModule.mk 2017-12-05 11:26:05 -06:00