A-Team_Digital_Solutions/android_kernel_motorola_sm6375
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android_kernel_motorola_sm6375/Documentation/thermal
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Repository files (latest commit first)
Filename Latest commit message Latest commit date
Durgadoss R 6ea083b18d Thermal: Add documentation for platform layer data 
This patch adds documentation for thermal_bind_params
and thermal_zone_params structures. Also, adds details
on EXPORT_SYMBOL APIs.

Signed-off-by: Durgadoss R <[email protected]>
Signed-off-by: Zhang Rui <[email protected]>
2012-11-05 14:00:09 +08:00
..
cpu-cooling-api.txt thermal: add generic cpufreq cooling implementation 2012-09-24 14:44:38 +08:00
exynos_thermal hwmon: exynos4: move thermal sensor driver to driver/thermal directory 2012-09-24 14:44:38 +08:00
sysfs-api.txt Thermal: Add documentation for platform layer data 2012-11-05 14:00:09 +08:00