A-Team_Digital_Solutions/android_kernel_motorola_sm6375
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android_kernel_motorola_sm6375/htc
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Repository files (latest commit first)
Filename Latest commit message Latest commit date
Poddar, Siddarth 416b70695e qcacmn: Add datapath layer changes for sdio bus (Part 4 - HIF SDIO) 
Remove bus specific calls from data path layer.
Add sdio specific target address.
Add sdio bundling rates in datapath layer.
Fix rx data callback for UMP system.

CRs-Fixed: 969334
Change-Id: I0cd45479ca89b97455b4a9c71ce326646f38a5f3
2016-06-14 13:48:19 -07:00
..
dl_list.h
htc.c qcacmn: Clean up header files for HTC 2016-04-01 11:53:21 -07:00
htc_api.h qcacmn: Add support for AP chipsets 2016-05-19 17:59:48 -07:00
htc_debug.h qcacmn: Fix compilation issues HTC/HIF 2016-03-16 12:18:31 -07:00
htc_internal.h qcacmn: Add datapath layer changes for sdio bus (Part 4 - HIF SDIO) 2016-06-14 13:48:19 -07:00
htc_packet.h qcacmn: Clean up header files for HTC 2016-04-01 11:53:21 -07:00
htc_recv.c qcacmn: Address win specific compilation issues 2016-05-19 18:00:13 -07:00
htc_send.c qcacmn: Add datapath layer changes for sdio bus (Part 4 - HIF SDIO) 2016-06-14 13:48:19 -07:00
htc_services.c qcacmn: Add support for AP chipsets 2016-05-19 17:59:48 -07:00