A-Team_Digital_Solutions/android_kernel_motorola_sm6375
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1,075 commits 10 branches 0 tags 2.1 GiB
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Repository files (latest commit first)
Filename Latest commit message Latest commit date
Manaf Meethalavalappu Pallikunhi dd0c146ee3 dt-bindings: thermal: Add support for CDSP cooling devices via qmi cdev 
Add support for CDSP DCVS and CDSP hardware cooling devices to QMI
cooling device driver. These cooling devices can be used to mitigate
CDSP subsystem at high temperature via qmi interface.

Change-Id: I064d5685e1c2c9c7d0406ee3bdd7f48169602a92
2020-04-20 12:10:31 -07:00
bindings dt-bindings: thermal: Add support for CDSP cooling devices via qmi cdev 2020-04-20 12:10:31 -07:00
qcom ARM: dts: msm: Add modem DSC mitigation nodes for lahaina 2020-04-16 13:04:34 -07:00
Makefile ARM: dts: vendor: Add an initial Makefile to the vendor 2019-06-04 16:50:48 -07:00