A-Team_Digital_Solutions/android_kernel_motorola_sm6375
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ARM: dts: msm: Add DDR cooling device for Lahaina

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Add DDR cooling device for Lahaina to vote for DDR bandwidth when the
DDR temp reaches 90C.

Change-Id: I83106de17b587e5b59f0a8b7cd1fe1dad5af15b2
This commit is contained in:
Ram Chandrasekar 2020-11-03 15:07:09 -08:00
commit 054bc305fd
1 changed files with 25 additions and 1 deletions
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26
qcom/lahaina-thermal.dtsi
View file

@ -53,6 +53,25 @@
reg = <0x00635000 0x1000>;
interrupts = <GIC_SPI 243 IRQ_TYPE_LEVEL_HIGH>;
};
ddr_cdev: qcom,ddr-cdev {
compatible = "qcom,ddr-cooling-device";
#cooling-cells = <2>;
qcom,ddr-freq = <762000>,
<1720000>,
<2086000>,
<2597000>,
<2929000>,
<3879000>,
<5161000>,
<5931000>,
<6515000>,
<7980000>,
<8136000>,
<10437000>,
<12191000>;
interconnects = <&mc_virt MASTER_LLCC &mc_virt SLAVE_EBI1>;
};
};
&cpufreq_hw {
@ -751,7 +770,7 @@
thermal-governor = "step_wise";
trips {
pop_trip: pop-trip {
temperature = <95000>;
temperature = <90000>;
hysteresis = <0>;
type = "passive";
};
@ -764,6 +783,11 @@
<&apc1_cluster THERMAL_NO_LIMIT
THERMAL_NO_LIMIT>;
};
pop_cdev1 {
trip = <&pop_trip>;
cooling-device = <&ddr_cdev 5 5>;
};
};
};