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Merge "ARM: dts: msm: Add DDR cooling device for Lahaina"

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qctecmdr 2020-11-09 23:34:42 -08:00 • committed by Gerrit - the friendly Code Review server
commit 735033efcf
2 changed files with 67 additions and 1 deletions
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42
bindings/thermal/qti-ddr-cdev.txt Normal file
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@ -0,0 +1,42 @@
QTI DDR cooling device.
The DDR cooling device will be used to place a DDR frequency vote. This
cooling device will be used in those cases where all the subsystem's are
thermally throttled and DDR has to be operated with a minimum performance
level. This cooling device vote can ensure the same.
Properties:
- compatible:
Usage: required
Value type: <string>
Definition: should be "qcom,ddr-cooling-device"
Cooling device node:
- qcom,ddr-freq:
Usage: required
Value type: <u32 array>
Definition: List of available DDR frequencies.
-#cooling-cells:
Usage: required
Value type: <integer>
Definition: Must be 2. Needed for of_thermal as cooling device
identifier. Please refer to
<devicetree/bindings/thermal/thermal.txt> for more
details.
Example:
qcom,ddr-cdev {
compatible = "qcom,ddr-cooling-device";
qcom,ddr-freq = <200000>,
<451000>,
<547000>,
<681000>,
<768000>,
<1017000>,
<1555000>,
<1708000>,
<2092000>,
<2736000>,
<3196000>;
#cooling-cells = <2>;
};

26
qcom/lahaina-thermal.dtsi
View file

@ -53,6 +53,25 @@
reg = <0x00635000 0x1000>;
interrupts = <GIC_SPI 243 IRQ_TYPE_LEVEL_HIGH>;
};
ddr_cdev: qcom,ddr-cdev {
compatible = "qcom,ddr-cooling-device";
#cooling-cells = <2>;
qcom,ddr-freq = <762000>,
<1720000>,
<2086000>,
<2597000>,
<2929000>,
<3879000>,
<5161000>,
<5931000>,
<6515000>,
<7980000>,
<8136000>,
<10437000>,
<12191000>;
interconnects = <&mc_virt MASTER_LLCC &mc_virt SLAVE_EBI1>;
};
};
&cpufreq_hw {
@ -751,7 +770,7 @@
thermal-governor = "step_wise";
trips {
pop_trip: pop-trip {
temperature = <95000>;
temperature = <90000>;
hysteresis = <0>;
type = "passive";
};
@ -764,6 +783,11 @@
<&apc1_cluster THERMAL_NO_LIMIT
THERMAL_NO_LIMIT>;
};
pop_cdev1 {
trip = <&pop_trip>;
cooling-device = <&ddr_cdev 5 5>;
};
};
};