Add cooling-cells property to enable the battery mitigation to be
referenced in thermal zone devicetree configurations.
Change-Id: I8fbc011660ad9446dfa347388ab2a69f1309f3f5
Add PMIC die temperature mitigation for Lahaina. The mitigation will
trigger at the first PMIC alarm at 95C.
Change-Id: I55f1c7b0eb637e417a3baabdd8d9b245439062cb
Add thermal zone to monitor modem junction temperature for 100C and
trigger mitigation using the modem junction QMI cooling device for
Lahaina.
Change-Id: Ib28a46680fbdc19979aa3b72d34ccee73090ad1e
Add stub interconnect devices for aggre1_noc, aggre2_noc,
camnoc_virt, compute_noc, config_noc, dc_noc, gem_noc,
ipa_virt, mc_virt, mmss_noc, system_noc, gem_noc_display,
mc_virt_display, mmss_noc_display. This will allow consumers
to get their path and set bandwidth constraints on them.
Change-Id: I3c7b4af80eb8a3a644847070bc64c518c509dbb2
Add interconnect device bindings. These devices can be
used to describe any RPMH and NoC based interconnect devices.
Change-Id: I2c828560cb4c3979faff88d61569ee1a72800e64
Add interconnect device bindings. These devices can be
used to describe any RPM and NoC based interconnect devices.
Change-Id: Id7ab380c37f652367da5a5fb9188ed9a29cbe0c0
Add snapshot of device trees for PM6350, PM7250b and PM6150l
with base nodes for revid, pon, gpio, rtc and temp alarm
peripherals.
Include these three PMICs with PMK8350 for holi.
This snapshot is taken as of msm-4.19 commit f013531fb889
("Add eMMC inline crypto engine node for scuba") with the following
modifications:
- removed charger,QG, pd_phy from PM7250b
- removed flash, WLED from PM6150l
- removed GPIOs and thermal_zones from all PMICs
- corrected address format for all PMICs to match usage on kernel 5.4.
Change-Id: Ib3304759a0b99bf7f51b45460b7717c40704dbe5
Add SPMI PMIC arbiter device so that it is possible to
communicate with the PMICs attached to SPMI bus.
Change-Id: I21fa09b937a2ae18c0319e5da4ff4324099888bb
DP and DM high speed phy irq needs to be set to rising/falling edge
trigger based on the speed of the device connected in host mode. Hence
update same with Lahaina USB.
Change-Id: I10370d27668f25e7e308be1b891c8e836ce30f34
This change is to add RUMI specific property required for
console usecase. Serial driver use this property to manage
additional changes needed for RUMI console.
Change-Id: Id72ebc27b388ab3ca45ea762048b5f5314e9de72
By default, the size of the dmesg buffer is 128K. Due to additional
logging from drivers, the buffer overflows and the initial
set of logs are lost. Since these logs are critical for performance
measurements, increase the buffer size to 256K to preserve the logs.
Change-Id: I3645597754aab7dec9b2de22b4d6d14b88c994a3
The carveout heap type has changed to MSM_CARVEOUT, so
updated the TUI carveout heap type to MSM_CARVEOUT.
Change-Id: I44f4eeb838398f6b523e14023f8b4e7e7bbb6751
Add support for the new mmw related ADC thermistor support. The support
includes for the qmi sensors mmw_pa1, mmw_pa2, mmw_pa3, and
sdr_mmw_therm.
Change-Id: I055194031bba0a617513119b6760f43cf2c4eb98
Enable CDSP cooling devices like cdsp_sw and cdsp_hw for applying CDSP
thermal mitigation over QMI for Lahaina.
Change-Id: Ieaa26bff09286ae68f24aa322aff53396d5853e3
