A-Team_Digital_Solutions/android_kernel_motorola_sm6375
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77 commits 10 branches 0 tags 2.1 GiB
  • C 98.2%
  • Assembly 1%
  • Makefile 0.3%
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Repository files (latest commit first)
Filename Latest commit message Latest commit date
Jun-Hyung Kwon 4119481bc4 dt-bindings: qdsp: Device tree documentation for sensors ssc 
Device tree documentation for sensors ssc node which includes
firmware name to use.

Change-Id: Icee561955c545620509a595a91bf09238fe57e7f
2019-08-15 15:09:10 -07:00
bindings dt-bindings: qdsp: Device tree documentation for sensors ssc 2019-08-15 15:09:10 -07:00
qcom Merge "ARM: dts: msm: Add HWSPINLOCK, SMEM and SMP2P for Lahaina" 2019-08-13 15:21:24 -07:00
Makefile ARM: dts: vendor: Add an initial Makefile to the vendor 2019-06-04 16:50:48 -07:00